When the last chip is removed, the seemingly scrapped PCB is still a feast of resources: 0.3 g of gold, 13 g of copper, 2 g of palladium, and a second life for rare earths and epoxy resins. We adopt a combination process of "low-temperature desoldering and vacuum sorting". First, we let the solder melt precisely at 180°C, then gently separate the chips from the substrates. Subsequently, high-pressure electrostatic technology instantly "identifies" metals and non-metals based on their conductivity, with a copper recovery rate of 98% and a 12-fold increase in precious metal concentration. Throughout the process, nitrogen protection is used, with no chlorine, cyanide, or wastewater. VOCs emissions are less than 1/10 of the EU RoHS limits. Every piece of reborn copper foil will return to the motors of new energy vehicles and photovoltaic inverters; every captured gold and palladium will shine again in the next-generation 5G modules. Let the "electronic graveyard" become an "urban mine", and let the cycle start from PCBs and extend to a zero-carbon future.